2012mm,HE-MCC-21-32.768K-12.5,HEC无源晶振,32.768KHZ

2012mm,HE-MCC-21-32.768K-12.5,HEC无源晶振,32.768KHZ,欧美无源晶体,美国HEC晶体,无源SMD晶体,2012mm超小型晶振,无源晶振,音叉晶体,水晶振动子,两脚无源晶振,32.768K贴片晶振,尺寸2.0x1.2mm,频率32.768KHZ,负载12.5pF,无铅晶振,低损耗晶振,高性能晶振,高精度晶振,数字显示晶振,智能水表晶振,智能手表晶振,时钟晶振.

2012mm,HE-MCC-21-32.768K-12.5,HEC无源晶振,32.768KHZ,欧美无源晶体,美国HEC晶体,无源SMD晶体,2012mm超小型晶振,无源晶振,音叉晶体,水晶振动子,两脚无源晶振,32.768K贴片晶振,尺寸2.0x1.2mm,频率32.768KHZ,负载12.5pF,无铅晶振,低损耗晶振,高性能晶振,高精度晶振,数字显示晶振,智能水表晶振,智能手表晶振,时钟晶振.

2012mm,HE-MCC-21-32.768K-12.5,HEC无源晶振,32.768KHZ特点:

尺寸2.0x1.2mm

频率32.768K晶振

符合ROHS

高性能低损耗2012mm,HE-MCC-21-32.768K-12.5,HEC无源晶振,32.768KHZ 参数表

PARAMETERS	CONDITIONS	MINIMUM	STANDARD	MAXIMUM		UNIT
FREQUENCY RANGE			32.768			KHz
FREQ. TOLERANCE	at 25 °C		±20			PPM
DRIVE LEVEL			10μW typical 100μW Max.
OPERATING TEMPERATURE		-40 °C to +85 °C				°C
STORAGE TEMPERATURE		-40 °C to +85 °C				°C
SHUNT CAPACITANCE (CO)				1.5		pF
LOAD CAPACITANCE (CL)			12.5 pF			pF
ESR			70KΩ Max.
AGING CHARACTERISTICS			±3 PPM / year

2012mm,HE-MCC-21-32.768K-12.5,HEC无源晶振,32.768KHZ 尺寸图